高精密红外硅块检测仪

型号:LBA 300 3D

LBA 300 3D高精密红外硅块检测仪是专门为检测用于太阳能硅片生产的多晶硅块而研制的。它具有如下特点:

-有效辨别杂质层(如SiC集结物、晶体缺陷、微裂等)
-有效降低后道切片工序过程中的断线率
-有效提高硅片产量
-检测周期短
-可人工或运用生产线机械手装卸。
-检测结果以3维立体图显示
-可以分析硅锭铸锭质量

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