INGOT DUCTILE POLISH GRINDING AND CHAMFERING

Surface & chamfer grinding & polishing machines for monocrystalline silicon

Developed for significant surface damage reduction:
- Ductile polish grinding
- 50% wafer breakage reduction
- Grinding and polishing of 2 surfaces and
2 chamfers simultaneously without rechucking
- With patented TWIN-spindle ®

ADVANTAGES:

- High-end technology machine
- 6 grinding wheels, grinding of four surfaces in one stroke
- 50% reduction of cycle time
- Variable loading length
- Saving of consumable parts
- Mirror-like surface
- Fast return of investment

Dimension 125x125, 156x156 or 210x210 mm²
Length up to 800 mm
PV 1000 innen

GermanEnglishChina

By continuing to use this site, you agree to the use of cookies. more information

The cookie settings on this website are set to "allow cookies" to give you the best browsing experience possible. If you continue to use this website without changing your cookie settings, or you click "Accept" below then you are consenting to this.

Close