INGOT TOP & BOTTOM GRINDING

LBG 690 / 840 / 1100

Developed for multi-crystalline silicon ingots

Philosophy:
By removing the contaminated top surface it is possible, when reclaiming the cropped parts, to raise wafer yield of the next crystallized ingot

Advantages:
- High throughput with low costs
- Significant material waste reduction
- Less risk of wire breakage for squaring
- Flat surfaces for further processing
- Save up to 3% costs of wafer manufacturing
- Mechanical clamping
- Automatic grinding process

Technical data

Layout ~ 3000mm x 2200 mm
Height ~ 2600 mm
Weight ~ 5000 kgs
Ingot fixation mechanical
Max. in-feed 75 mm
Grinding wheel diamond wheel
Diameter 610-720 mm
Rotary table
Speed variable
Workpiece diameter 690/840/1100 mm²
Coolant water
El. power 15 kVA

 

bottomgrinder-300dpi

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