Saphire & Ceramics

By using the diamond wire technology our company has gained an advantage over competitors, such as optimized cutting process for sapphire ingots: Only half of the cutting time of the conventional cutting method and best surface quality of "as-cut" wafers are obtained, so that customer's satisfaction is written in the first place.

- Wafering
- Super thin grinding
- Diamond Wire

sapphire-line

We customize any of our machines to a high degree for you. For any questions about the above mentioned machines please contact us under info@logomatic.de or through our contact form. We are looking forward to your inquiry.

GermanEnglishChina

By continuing to use this site, you agree to the use of cookies. more information

The cookie settings on this website are set to "allow cookies" to give you the best browsing experience possible. If you continue to use this website without changing your cookie settings, or you click "Accept" below then you are consenting to this.

Close