Semiconductor

With our experience and compentence, we already served many leading companies with our grinding technology, such as the LSU600 x 175 CNC, the external cylindrical notch + / flat grinding. Today our grinding equipment is used all around the world.

Diamond Multi Micro Wire Saw DMMWS 3
Ingot grinding machine LSU 1000 x 175 CNC
Ingot grinding machine LSU 600 x 175 CNC
Thin grinding machine VTS 3
Diamond Wire

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