DMMWS III

The Diamond Multi Micro Wire Saw (DMMWS) is designed to slice 2-8 inch (12 inch option)

- Silicon
- Quartz
- SiC
- Glass
- Sapphire
- GaAs
- Germanium
- Ceramic
- Other brittle material

Our diamond wire slicing process for hard material has many advantages:
- Quick cuts
- High precision
- Minimal loss of material
- Super thin slices
- Only water needed instead of slurry

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