Fully automatic vertical surface high
precision grinder with rotary table

- Fully enclosed grinding area (sliding door)
- Inprocess gauge optional
- Automatic fine infeed
- PLC-automation
- Rotary table (magnet or vacuum)

Rough and finish grinding of metals and
other materials at highest flatness accuracy
(> 1 micron).

Application optimum

The automatic fine downfeed enables the
economical use in large scale production
with high precision requirements.
Ultra-thin grinding of Si, SiC, Sapphire,
Quartz, Ge, GaAs and other ceramics (2 - 12 inch)

Example for 2 inch wafer:
final thickness for Si, 25 µm
final thickness for Sapphire, 60 µm

Technical data

Spindle motor 2.2 kW
Spindle speed 2,560 min-1
AC connection 3.2 kVA
Precision 3 µm
Twin wheel 200/175 mm
Rotary table 300 mm
Rotary table speed 0-30 min-1
Fine downfeed 1 µm
Range 12 mm
Coolant DI-water
Weight 780 kg
Space 1400 x 950 mm


By continuing to use this site, you agree to the use of cookies. more information

The cookie settings on this website are set to "allow cookies" to give you the best browsing experience possible. If you continue to use this website without changing your cookie settings, or you click "Accept" below then you are consenting to this.