SERVICE FOR DIAMOND TOOLS
Logomatic offers a wide range of service.
- Diamond wire
- Grinding and regrooving of wire guide rolls (WGR Groove grinder)
- New coating of wire guide rolls (Polyurethan, longlifetime PU)
- Turnkey solution for "Wafer-Fabs"
- Engineering with partner company
- Multi-Si ingot bricking / squaring
- Multi-Si brick grinding
- Multi-Si brick infrared inspection
- Multi-Si brick cropping
- Mono-Si ingot bricking / squaring
- Mono-Si ingot grinding
- Wafer thin grinding down to 80 µm, 2-8 inch
SAPPHIRE + CERAMIC
- Orientation and gluing
- Cutting with our diamond wire technology
- Sapphire wafering 2-8 inch (max. 12 inch)
- Turnkey solution for sapphire wafer production
- Individual customer requests
We are proud to serve manifold customers worldwide and are looking forward to serve you, too. For any questions about the above mentioned services please contact us under firstname.lastname@example.org or through our contact form. We are looking forward to your inquiry.