SiC BOULE GRINDER Q2 incl. flat
MACHINE DESCRIPTION
The Revolution in External Cylindrical Grinding Technology - Q2
Our specially designed Q2 External Cylindrical Grinding Machine is more than just a grinder; it's a fully automated, high-precision solution for processing SiC Boules in the semiconductor industry. With integrated Flat feature for workpieces with 6 and 8-inch diameters, the Q2 sets new standards.
User-Friendliness Meets Technology
The intuitive, dialogue-based control system of the Q2 allows for easy navigation and operation. Even complex grinding operations are simplified through multiple program selections.
Precision at its Finest
Based on prior X-ray measurements, the exact position for Flat is automatically and precisely determined and transferred into the Q2. In-process monitoring technologies such as acoustic emission sensors and measurement technology guarantee flawless workpieces without chipping and cracks.
Sustainability and Efficiency
The Q2 is an innovation from the ground up and surpasses modified competitor products in terms of efficiency. It reduces electricity and water consumption by more than 50%, thus offering significant cost savings.
Compact Design, Big Impact
With a compact footprint of only 2.56 m² (1.6 * 1.6m), the Q2 is the smallest machine of its kind worldwide. It allows for the installation of three Q2 machines in the space of one competitor machine.
Technical Specifications
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External dimensions: approx. 1.6 * 1.6 * 1.9 m
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Weight: approx. 4.5 tons
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Electrical consumption: approx. 15 kW
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Water consumption: 6,000 liters/year
Contact us for more information and experience the future of grinding technology.
SiC BOULE GRINDER Q2
ABOUT US
Logomatic GmbH is a medium-sized company and part of the Könnemann Group.
Founded in 1974 by Dipl.-Ing. Gerhard Könnemann.
At that time, the company focused on special grinding machine construction for customised grinding applications for the automotive and aerospace industries. In the late 2000s, innovation steps were taken for promising industries such as semiconductors and photovoltaics. With this turnaround, cutting technology using diamond wire was innovatively operated and implemented in addition to grinding technology. To date, well over 100 systems have been sold worldwide.
In 2019, his son, Ronny Könnemann, took over the company.
He took up the grinding machine sector. Today, external cylindrical grinding machines for hard and brittle materials such as silicon, sapphire, and silicon carbide (SiC) are designed and built according to the highest technological approach.